Floorplet: Performance-Aware Floorplan Framework for Chiplet Integration
Shixin Chen, Shanyi Li, Zhen W. Zhuang, Su Zheng, Liang Zheng, Tsung-Yi Ho, Bei Yu, Alberto L. Sangiovanni-Vincentelli
Chinese University of Hong Kong University of California, Berkeley
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摘要与影响
A chiplet is an integrated circuit (IC) that encompasses a well-defined subset of an overall systems functionality. In contrast to traditional monolithic system-on-chips (SoCs), chipletbased architecture can reduce costs and increase reusability, representing a promising avenue for continuing Moore’s Law. Despite the advantages of multi-chiplet architectures, floorplan design in a chiplet-based architecture has received limited attention. Conflicts between cost and performance necessitate a trade-off in chiplet floorplan design since additional latency introduced by advanced packaging can decrease performance. Consequently, balancing performance, cost, area, and reliability is of paramount importance. To address this challenge, we propose Floorplet (Floorplan chiplet), a framework comprising simulation tools for performance reporting and comprehensive models for cost and reliability optimization. Our framework employs the open-source Gem5 simulator to establish the relationship between performance and floorplan for the first time, guiding the floorplan optimization of multi-chiplet architecture. The experimental results show that our method decreases inter-chiplet communication costs by 24.81%.
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工程VLSI and FPGA Design Techniques
3D IC and TSV technologies · Low-power high-performance VLSI design
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