A Signal Integrity (SI)-Driven Comprehensive Framework for High-Speed Interconnect Designs and Evaluations in Advanced System-in-Package (SiP) Systems

Advanced system-in-package (SiP) systems, which integrate multiple chiplets, have recently expanded with regard to their design flexibility by utilizing diverse package platforms and interface technologies, though this has also significantly increased the design space complexity. However, exploring this expanded design space to identify optimal design configurations through traditional methods requires a significant amount of time and incurs a high cost. To address this challenge, this article proposes a signal integrity (SI)-driven comprehensive framework for the design and evaluation of high-speed interconnects in chiplet-based SiP systems. Interconnect design and evaluation comprise the two key stages of the proposed framework. The design stage systematically integrates routability analysis, channel design, and reference plane design to provide package platform-independent design guidelines while ensuring implementation feasibility under high-density routing constraints. The evaluation stage introduces frequency-domain voltage transfer function (VTF)-based SI metrics that efficiently estimate eye aperture and overshoot characteristics without time-consuming time-domain simulations. The proposed metrics are validated across various SiP system configurations, demonstrating strong correlations with eye diagram simulations under different channel locations, structures, and data rates. The integrated framework enables the efficient exploration of complex SiP interconnect design spaces and provides a systematic design methodology for next-generation heterogeneous integration platforms.