A Dynamic Temperature Compensation Method for Piezoresistive Pressure Sensors Using Heat Transfer Analysis

Piezoresistive pressure sensors are prone to temperature drift. The existing software compensation methods typically correct temperature drift based on environmental temperature. While these methods often achieve excellent static temperature compensation, their dynamic compensation performance is limited due to the lag between the chip temperature and the environmental temperature. To address this issue, this article proposes a dynamic temperature compensation method for piezoresistive pressure sensors, grounded in heat transfer analysis. The approach accurately predicts the thermal drift of the piezoresistive chip in relation to ambient temperature, significantly enhancing the precision of temperature compensation. By examining the heat convection and conduction processes within the piezoresistive pressure sensor, a transient thermal impedance network for the sensor core is constructed. Utilizing this network, the proposed method can precisely forecast the temperature of the piezoresistive chip. Even under dynamically changing ambient conditions, it effectively compensates for the thermal drift of the piezoresistive pressure sensor. The performance of the temperature compensation strategy is validated through tests involving both step changes and continuous variations in temperature.