BEOL-Compatible Ferroelectric Capacitor of 5 nm Ultrathin HZO With High Remanent Polarization and Excellent Endurance
Li-Cheng Teng, Yu-Che Huang, Shu-Jui Chang, Shin-Yuan Wang, Yu-Hsien Lin, Chao‐Hsin Chien
National Yang Ming Chiao Tung University Taiwan Semiconductor Manufacturing Company (Taiwan) National United University
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摘要与影响
In this letter, we have successfully fabricated a metal-ferroelectricity-metal (MFM) capacitor of an ultrathin 5 nm HZO utilizing Molybdenum (Mo) as the electrodes. By proposing a novel atomic layer deposition (ALD) scheme, we overcome the challenge of oxidation of the lower Mo electrode; a 2 nm HZO deposited by thermally enhanced ALD followed by a 3 nm HZO deposited by plasma enhanced ALD. The fabricated sample demonstrated a 2Pr value of 38.5 μC/cm2at an operating voltage of 2V. Furthermore, in endurance testing, the sample maintained a 2Pr value of 36.9 μC/cm2even after 1010cycles (△2Pr/2Prpristine≈ 7% from pristine to 1010cycles). With a maximum process temperature of 400°C, our approach thereby meets the stringent requirement of Back-End-of-Line (BEOL) integration.
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