The Role of Wafer Edge in Wafer Bonding Technologies
Roy Knechtel, Uwe Schwarz, Sophia Dempwolf, Andy Nevin, Holger Klingner, Gunnar Lindemann, Marc Schikowski
Schmalkalden University of Applied Sciences Foundry (United Kingdom)
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Wafer bonding is an important process step in microsystem technologies for processing engineered substrates and for capping. Usually the work and literature are focused on the bonding of the main wafer area. However, in recent years MEMS technologies have become more complex, with more process steps after wafer bonding. Accordingly, the wafer edge is becoming more and more important, and must be engineered. Methods for realizing this are discussed in this paper.
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