The Importance of Wafer Edge in Wafer Bonding Technologies and Related Wafer Edge Engineering Methods
Roy Knechtel, Uwe Schwarz, Sophia Dempwolf, Holger Klingner, Andy Nevin, Gunnar Lindemann, Marc Schikowski
Carl Zeiss Foundation Schmalkalden University of Applied Sciences Klinikum Itzehoe
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Wafer bonding is an important process step in microsystem technologies for processing engineered substrates and for capping. Usually, the work and literature are focused on the bonding of the main wafer area. However, in recent years MEMS technologies have become more complex, with more process steps after wafer bonding. Accordingly, the wafer edge is becoming more and more important, and must be engineered. Methods for realizing this are discussed in this paper.
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