研究论文
Research and Application of Copper Electroplating in Interconnection of Printed Circuit Board
Chong Wang, Chuan Peng, Jing Xiang, Yuanming Chen, Wei He, Xinhong Su, Yuyao Luo
来源Journal of Electrochemistry
年份2021
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工程Electrodeposition and Electroless Coatings
Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability
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引用本文 8
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
被引 19Chuan Xiao Peng, Yuehui Zhai, Xianming Chen · Molecules · 2023
Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application
被引 10Zhao‐Yun Wang, Daquan Yu, Lei Jin · Journal of Manufacturing Processes · 2024
Pentaerythritol-Based Compound as a Novel Leveler for Super-Conformal Copper Electroplating
被引 9Zumin Chen, Zhengquan Li, Cui Liu · Journal of The Electrochemical Society · 2024
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