研究论文
1.6Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications
Saeed Fathololoumi, Kimchau N. Nguyen, Hari Mahalingam, Meer Sakib, Zhi Li, Christopher S. Seibert, Mohammad Montazeri, Jian Chen 等 22 位
Intel (United States)
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摘要与影响
摘要 · 完整
We demonstrate 1.6Tbps Silicon Photonic Integrated Circuit (SiPIC) meeting co-packaged optics requirements for network switch applications. The SiPIC has sixteen 106Gbps PAM4 optical channels, including lasers, modulators and V-grooves. Post-FEC error-free operation over temperature is demonstrated.
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学术脉络
学科主题
工程Photonic and Optical Devices
Optical Network Technologies · Advanced Photonic Communication Systems
参考文献 7
Device and Integration Technology for Silicon Photonic Transmitters
被引 120Hyundai Park, Matthew N. Sysak, Hui‐Wen Chen · IEEE Journal of Selected Topics in Quantum Electronics · 2011
Integrated Hybrid Lasers and Amplifiers on a Silicon Platform
被引 8Richard Jones, Matthew N. Sysak, Hyundai Park · 2008
Network Architecture in the Era of Integrated Optics
被引 9Cyriel Minkenberg, Nick Kucharewski, Germán Rodríguez · Journal of Optical Communications and Networking · 2018
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引用本文 60
Taking silicon photonics modulators to a higher performance level: state-of-the-art and a review of new technologies
被引 399Abdul Rahim, Artur Hermans, Benjamin Wohlfeil · Advanced Photonics · 2021
Co-packaged optics (CPO): status, challenges, and solutions
被引 172Min Tan, Jiang Rong Xu, Siyang Liu · Frontiers of Optoelectronics · 2023
1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration
被引 150Saeed Fathololoumi, David Hui, Susheel Jadhav · Journal of Lightwave Technology · 2020
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