Thermal optimization of the 3-D integrated circuits with fractal micro-channels

The thermal optimization management is one of the key issues in 3-D integrated circuits (3D-IC). This paper leverages the dendritic biomimetic structures’ superior thermal properties to probe the thermal management for the 3D-IC via introducing two different fractal micro-channels, which are Y-shaped and T-shaped fractal micro-channels. Three different 3D-IC thermal models with the different micro-channels such as the straight, Y-shaped fractal, and T-shaped fractal micro-channels are designed and simulated via ANSYS FLUENT. Identical boundary comparisons across inlet velocities show fractal designs reduce heat-source temperatures by 20-25°C (13.9%-32.3%) vs. straight channels. T-shaped micro-channels consistently outperformed Y-shaped, cutting peak hotspot temperature by 1.54-3.90°C, with the margin widening at higher flow rates, evidencing superior systemic cooling. At 1.5 m/s, three cross-sectional flow analyses reveal fractal cooling superiority stems from synergistic targeted jet cooling and boundary-layer resetting. Y- and T-shaped fractal micro-channels demonstrate substantial advantages over conventional designs for 3D-IC cooling.